The entire value chain


Discussions at the LOPEC trade fair

LOPEC offers visitors a comprehensive range of topics and innovative products. Here you can find representatives from every step of the printed electronics value chain and guests are able to experience all facets of this fascinating sector under one roof.

One of LOPEC's biggest strengths is that it really gives participants the chance to find out about every single aspect of the printed electronics industry. We cover the full value chain, from research and development to mass production, including applications and business models.

Exhibitors showcase materials, processes, systems, components, applications and services. Here guests can obtain a comprehensive overview of the industry and its products—all under one roof. You will be glad that you didn't miss out on the LOPEC experience.

Printed electronics

1. Materials
Printed electronics uses numerous organic and inorganic functional materials that can feature a number of characteristics, including (semi)conductivity, electroluminosity, electrochromism and electrophoresis. The value of substrates (adapted to suit a range of applications) is growing, as is the importance of encapsulation materials, which wide the lifespan of applications.
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
Substrates
Conducters
Semiconductors
Dielectrics
Encapsulation materials, resins and adhesives
Other materials
2. Manufacturing processes
The range of possible materials and applications is vast and this diversity is also reflected in the various technologies used to produce them. Mass printing processes, both analog and digital, are being applied. However, ink-jet printing and coating techniques are also being increasingly used.
2.1.
2.2.
2.3.
2.4.
2.5.
2.6.
2.7.
2.8.
2.9.
2.10.
2.11.
2.12.
2.13.
2.14.
Mass patterning techniques
Digital printing
Other printing processes
Vacuum processes
Photolithography
Laser
Solution Coating
Material processing
Light induced processing
Dosing and mixing technologies
Encapsulation
Clean room technology
Roll-to-roll processing
Other manufacturing processes
3. Assembly and packaging technology, system integration
Well-engineered packaging is essential for device integration. This process makes use of both specific technologies and those known from conventional electronics. Hybrid systems, which combine the benefits of printed electronics and their more conventional counterparts, are becoming increasingly important here.
3.1.
3.2.
3.3.
3.4.
Electronics assembly and packaging
Lamination
Electronics assembly and packaging, system integration
Hybrid systems (polytronics)
4. Inspection and test systems
In order to ensure product quality, precise and reliable testing and inspection systems are required that guarantee reliable results, even at high throughput rates. It is fairly common for new materials to require completely new testing systems to meet the increased requirements.
4.1.
4.2.
4.3.
4.4.
4.5.
4.6.
4.7.
4.8.
Electrical characterization
Physical/optical characterization
Chemical characterization
Simulation/circuit optimization
Lifetime testing
Quality/process control
Environmental testing
Other inspection and test systems
5. Devices
The majority of conventional electronic components have now been adapted for use with printed electronic; some are now even being mass produced (e.g., OLED displays). These core elements are essential for complex systems.
5.1.
5.2.
5.3.
5.4.
5.5.
5.6.
5.7.
5.8.
5.9.
5.10.
5.11.
5.12.
Transistors
Diodes
Passives
Integrated circuits
Displays
Photovoltaic cells
Sensors
Memory elements
Antennas
Batteries
Components for hybrid systems
Other devices
6. Applications
Technical progress means that printed basic devices are now being integrated into increasingly complex systems. This allows existing applications to be optimized and completely new applications, e.g., smart textiles, to be developed.
6.1.
6.2.
6.3.
6.4.
6.5.
6.6.
6.7.
6.8.
6.9.
6.10.
TFT backplanes
Displays
Sensors
Smart objects
RFID
Solar cells
Smart textiles
Speakers
Lighting
Other applications
7. Services
The more complex the printed electronic products are and the more sophisticated the production process is, the more important the related service industry becomes.
7.1.
7.2.
7.3.
7.4.
7.5.
7.6.
7.7.
7.8.
7.9.
Consulting
R&D funding management
R&D / Research & Development
Prototyping
Manufacturing
Venture and equity capitalization
Professional and trade associations
Technical books, technical journals, technical publishers
Other services

A full index of the LOPEC products and services can be found here:

 
 
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LOPEC registration

Everything from research to application

As the leading event for printed electronics, LOPEC covers all areas of the value chain: research, development, and applications.

LOPEC registration

Everything from research to application

As the leading event for printed electronics, LOPEC covers all areas of the value chain: research, development, and applications.

Everything from research to application

As the leading event for printed electronics, LOPEC covers all areas of the value chain: research, development, and applications.

Printed electronics product at LOPEC

Who appears at LOPEC?

Are you keen to know who is exhibiting at LOPEC? Or who will be speaking at the conference? The highlight of the trade fair?

Printed electronics product at LOPEC

Who appears at LOPEC?

Are you keen to know who is exhibiting at LOPEC? Or who will be speaking at the conference? The highlight of the trade fair?

Who appears at LOPEC?

Are you keen to know who is exhibiting at LOPEC? Or who will be speaking at the conference? The highlight of the trade fair?

News

  • Call for Papers
  • We are still accepting entries for our Start-up Forum until January 14, 2018!
  • OE-A Seminars
  • Printed Electronics Insights – OE-A Seminars at the productronica innovation forum.
  • Final report 2017
  • Printed electronics reaches new dimensions.
  • Impressions
  • Our photo gallery offers a glimpse of LOPEC.
  • Podcast
  • The LOPEC world in motion.

News

News

  • Call for Papers
  • We are still accepting entries for our Start-up Forum until January 14, 2018!
  • OE-A Seminars
  • Printed Electronics Insights – OE-A Seminars at the productronica innovation forum.
  • Final report 2017
  • Printed electronics reaches new dimensions.
  • Impressions
  • Our photo gallery offers a glimpse of LOPEC.
  • Podcast
  • The LOPEC world in motion.