Technical Conference topics

Technical Conference. Speakers at the Technical Conference.

The Technical Conference provides status updates on the development of specific products and business sectors.

The Technical Conference is industry and application oriented and promotes the ongoing development of products and business segments.

Smart and hybrid systems

  • Technical challenges of Printed electronics systems and integration, including hybrid integra-tion and sensing.

Flexible Displays and Lighting:

  • Flexible display and lighting technologies and manufacturing
  • Novel products and applications

Touch, tactile and haptic feedback

  • Covers new trends in touch panels, tactile and haptic feedback, and airborne haptics

Wearable electronics

  • Technical challenges and advances in wearable and stretchable electronics applications


  • Technologies for energy production, harvesting and storage including
    • OPV (organic photovoltaics)
    • CIGS (copper indium gallium selenide)
    • DSSC (dye-sensitized solar cells)
    • Perovskites
    • Batteries and super capacitors

IoT (Internet of Things)

  • Covers challenges and use cases of large area, printed or organic electronics in internet-of-things applications

Upscaling Production and Manufacturing Processes

  • Challenges and advances in upscaling production, printing and patterning processes
  • 3D printing technologies
  • Quality control in production lines

Biomedical applications

  • Covers challenges and use cases of large area, printed or organic electronics in bio-medical applications

Functional Materials

  • Organic, Inorganic and hybrid materials
  • Novel materials like graphene
  • Active and passive materials

Substrates and Encapsulation

  • Recent advancements on substrate technologies including encapsulation

Publicly Funded Projects

  • Latest achievements in publicly funded projects

Lighting in mobility applications

  • automotive and aerospace as focus application areas, OLED lighting, signage, integration for required applications, smart enhancement of OLED light source for named application areas, smart integrated functionality in OLED lighting for application areas, interior and exterior light-ing applications alike

3D MID (Mechatronic interconnect devices)

  • MID technology (MID – Mechatronic Integrated Devices) enables the integration of mechan-ical, electronic, thermal, fluidic and optical functions in three-dimensional shaped circuit car-riers. Suitable substrate materials range from thermoplastics, thermosets, glass and ceram-ics up to specially coated metals. Characterized by the various potentials of MID technology and by the prospects of emerging, promising technologies, such as printed electronics and additive manufacturing, the term MID formerly known as Molded Interconnect Devices ex-pands to Mechatronic Integrated Devices.

Technical Conference Chair:
Dr. Ton van Mol, Holst Centre (NL), Managing Director

In addition to the presentations, the Technical Conference will be hosting a Poster Session. Here, new ideas or technologies are presented in short form. The posters will be presented in the ICM foyer where theyare made accessible to all trade fair and conference visitors.

As part of this session, the authors of the posters are present to answer any questions visitors may have about the interesting and innovative issues they raise. This will take place on March 14, 2018 from 18:00 to 20:00. This event is also open to all visitors attending both the Conference and the trade fair. Here, through one-on-one discussions, guests can gain further knowledge and establish useful contacts.

Technical Conference

Program & Speakers 2018