The Technical Conference provides status updates on the development of specific products and business sectors. It is industry and application oriented and promotes the ongoing development of products and business segments.
Technical challenges of combining film-based electronics with discrete components for IoT applications. Topics include printed electronic components and systems, including interconnection technologies and integration methods, hybrid integration and sensing, and applications.
Materials and technologies for emerging display applications, including novel emitters (OLED, QDs, perovskites, microLEDs), novel manufacturing routes, additional in-display functionality, and integration challenges in IoT, smart phone displays, TV screens and automotive displays.
Recent advancements and use cases on how printed electronics enables unique touch, gesture and haptic trends in human-machine interactions by creating smart, interactive surfaces in applications like automotive, home appliance, medical and others.
Technical challenges and advances in wearable and stretchable electronics applications.
Technologies for energy production, harvesting and storage, including thin-film photovoltaics (Organic solar cells, perovskites, CIGS (copper indium gallium selenide) and DSSC (dye-sensitized solar cell), thermoelectrics, thin-film batteries and supercapacitors.
Challenges and advances in upscaling production, printing and patterning processes, including inspection and manufacturing reliability and quality control in production lines.
Challenges and use cases of large area, printed or organic electronics in biomedical applications. This includes all applications in biomedical and healthcare such as sensors, diagnostic devices and wearable health patches that contain significant printed and flexible elements.
Organic, inorganic and hybrid materials for opto-electronic devices, novel materials like graphene, active and passive materials that can be deposited cost-effectively over large area.
Next Generation Flexible Substrates and Encapsulation Materials and Technologies.
(O/µ) LED lighting, signage, integration for required applications, smart enhancement of light sources, smart integrated functionality in (O)LED lighting, and its applications in particular in automotive, aerospace, packaging and wearables.
Integration of electronics and other multi-physical functions onto structural elements e.g. via 3D printing, laser structuring, in-molding, thermoforming, or 3D MID and its application in mobile electronics, automotive, aerospace, medical devices, sensors and connectors, household appliances, wearables and clothing.
Challenges and advances in materials and integration of various functionalities in textiles. Topics include the interconnection between soft and hard components, advantages of textiles over other transfer media and use cases in close to body scenarios.
Prof. Gerwin Gelinck, TNO/Holst Centre (NL), Program Director
In addition to the oral presentations, we will also offer a poster exhibition. This means that instead of giving a presentation, you can display the essential information on an A0 poster on both days of the exhibition. During the Poster Session on Wednesday, March 23, 2022 from 18:00 to 19:30, you can communicate with the event participants personally and answer any questions on the spot.